SolidSense N6 Indoor Quick Start Guide

Revision and Notes

Date

Owner

Revision

Notes

 

Introduction

The following quick start guide provides background information about the SolidSense N6 Indoor Edge Gateway.

SolidSense N6 Edge Gateway is an enterprise Internet of Things gateway designed for servicing a local network of IoT devices with a range of solutions and business applications. SolidSense is the ultimate IoT M2M solution, with high-end connectivity options, on an industrial grade fanless platform in both an indoor and outdoor configuration.

Based on the robust and modular NXP i.MX6 Arm Cortex A9 Single/Dual/Quad-core processor, SolidSense is a feature-rich edge platform designed to provide flexibility for developers and OEMs in implementing an almost endless range of IoT solutions.

Specifications

 

LTE Europe (EU)

LTE USA (US)

LTE Australia (AU)

Ethernet

 

LTE Europe (EU)

LTE USA (US)

LTE Australia (AU)

Ethernet

I/Os

4 x USB 2.0

4 x USB 2.0

4 x USB 2.0

4 x USB 2.0

Networking

1 x Ethernet RJ45 10/100/1000 (max 470 MB/s)
1 x 802.11 a/b/g/n WiFi and Bluetooth (2.4 GHz)
1 x Dual BLE 5.0 (SDR based on nRF52832)
1 x LTE Cat 4 EU + GPS (with fallback on 3G/2G)
Optional LTE Cat M1 (Worldwide) + EGPRS

1 x Ethernet RJ45 10/100/1000 (max 470 MB/s)
1 x 802.11 a/b/g/n WiFi and Bluetooth (2.4 GHz)
1 x Dual BLE 5.0 (SDR based on nRF52832)
1 x LTE Cat 4 US + GPS (with fallback on 3G/2G)
Optional LTE Cat M1 (Worldwide) + EGPRS

1 x Ethernet RJ45 10/100/1000 (max 470 MB/s)
1 x 802.11 a/b/g/n WiFi and Bluetooth (2.4 GHz)
1 x Dual BLE 5.0 (SDR based on nRF52832)
1 x LTE Cat 4 AU + GPS (with fallback on 3G/2G)
Optional LTE Cat M1 (Worldwide) + EGPRS

1 x Ethernet RJ45 10/100/1000 (max 470 MB/s)
1 x 802.11 a/b/g/n WiFi and Bluetooth (2.4 GHz)
1 x Dual BLE 5.0 (SDR based on nRF52832)

Processor

NXP i.MX6 Arm Cortex A9 Dual core 800MHz

NXP i.MX6 Arm Cortex A9 Dual core 800MHz

NXP i.MX6 Arm Cortex A9 Dual core 800MHz

NXP i.MX6 Arm Cortex A9 Dual core 800MHz

Memory & Storage

1GB DDR3
8GB eMMC
MicroSD

1GB DDR3
8GB eMMC
MicroSD

1GB DDR3
8GB eMMC
MicroSD

1GB DDR3
8GB eMMC
MicroSD

Display

HDMI

HDMI

HDMI

HDMI

Misc.

Programmable LEDs

Programmable LEDs

Programmable LEDs

Programmable LEDs

Development and Debug interfaces

Console port (internal)

Console port (internal)

Console port (internal)

Console port (internal)

Power

9V to 36V via twist and lock jack

9V to 36V via twist and lock jack

9V to 36V via twist and lock jack

CE, FCC/CSA

Temperature

-25°C to 65°C

-25°C to 65°C

-25°C to 65°C

-25°C to 65°C

Dimensions

120 x 80 x 30mm

120 x 80 x 30mm

120 x 80 x 30mm

120 x 80 x 30mm

Enclosure

Extruded aluminum, 5 x SMA (3 x 2.4GHz, LTE, GPS)

Extruded aluminum, 5 x SMA (3 x 2.4GHz, LTE, GPS)

Extruded aluminum, 5 x SMA (3 x 2.4GHz, LTE, GPS)

Extruded aluminum, 3 x SMA (3 x 2.4GHz)

Environmental Ratings

Operating Temperature

-25C to 65C

Storage Temperature

-20C to 80C

Ambient Relative Humidity

5% to 95% (non condesnsing)

Block Diagram

The following figure describes the SolidSense N6 Indoor Edge Gateway Block Diagram.

 

Visual features overview

Please see below the features overview of the top side of the product.

Feature Specifications

SMA Connectors

The SolidSense N6 indoor features 5 SMA connectors as described below:

From left to right:

 

 

LTE – Quectel EC25 (Main) | SMA

 

 

Please Note

For more information about the antennas used (optional) with the SolidSense N6 indoor please see this article : SolidSense N6 Indoor Kits

 

The assembly of the u.FL to SMA cables can be seen in the picture below;

LED

Bi-color (Red,Green) LEDs, Datasheet can be found here,
For user programming / indication / status.

HDMI

SolidSense uses PN ABA-HDM-051-P01 by LOTES

USB

SolidSense uses PN USB-A2D16F-2B8N by CZT

Each USB port is able to provide up to 0.5A

MicroSD

SolidSense uses PN ZM90-15000-0BR1 by CEN LINK, Datasheet can be seen here: http://www.cenlink.com.tw/upload/20120718204404.pdf 

Ethernet

SolidSense uses PN B50(15-02)G8-09-A023-B52 by BTOP : http://www.magnetic-rj45jack.com/sale-10691195-bicolor-led-rj45-connector-port-high-performance-for-maximum-emi-suppression.html

Please Note

Due to internal i.MX6 buses the 1000Mbps interface speed is limited to 470Mbps.

DC jack

  • Input voltage range: 9-36V

  • Power consumption idle:  0.4W

  • Power consumption maximum: 8W

  • Diameter : Outer 5.5mm , Inner 2.1mm with twist & lock feature

Please refer to this article for more information :  i.MX6 Application Note – Suspend to Memory Power Measurements

The system can be used in 4 ways

  1. Ready to go SolidSense IoT platform (SolidSense Out-Of-the-Box) with Eclipse Kura Framework and Wirepas/Bluetooth Low Energy MQTT gateways built-in applications. Configure the gateway via Kura and that’s it you can directly have your data forwarded to your cloud application.

  2. Developing your own application or add-on on top of the platform. Simple additions can be developed via Python 3.7 using the pre-installed packages. For more sophisticated development, a Docker infrastructure is ready to host your containers.

  3. Create your own SolidSense image derived from SolidSense OOB.

  4. From bare metal. You can create your own Linux image starting from SolidRun BSP. The support for these developments are not covered in the SolidSense section.

The product comes with a SolidSense built in software and ready to go.

Network Configuration

For managing your IoT gateway, monitor the gateway status, and manage the network configuration, you can refer to Configuring SolidSense networking with Kura .

Please see below picture to get the serial number for SSID of the network.

Mesh Network - Wirepas

If you are using SolidSense as a Wirepas gateway you can directly configure your Wirepas gateway by referring to Configuring and testing the Wirepas gateway software .

For flashing or re-flashing Wirepas sinks, please refer to Flashing or Re-flashing Wirepas sinks on SolidSense gateway (V0.9 and up) .

RF Performance

TI1831MOD

WiFi Receive Specifications

 

 

 

 

 

Parameter

Test condition

Min

Typical

Max

Units

Frequency

2.4-GHz Receiver Characteristics

2412

 

2484

MHz

Sensitivity

802.11b at 11Mbps

 

-87.9

 

dBm

 

802.11g at 54Mbps

 

-74.9

 

dBm

 

802.11n at MCS7 HT20

 

-72.4

 

dBm

 

802.11n at MCS7 HT40

 

-67

 

dBm

WiFi Transmit Specifications

 

 

 

 

 

Output Power

 

 

17.4

 

dBm

Approvals

  • FCC (USA)

  • ISED (Canada)

  • ETSI/CE (Europe)

  • MIC (Japan)

U-Blox Nina B1

BLE Receive Specifications

Test condition

Min

Typical

Max

Units

Frequency Range

 

 

2440

 

MHz

Sensitivity

 

 

-95

 

dBm

 

BLE Transmit Specifications

Test condition

Min

Typical

Max

Units

Output Power

 

 

7

 

dBm

Approvals

  • Europe

  • USA

  • Japan

  • Taiwan

  • South Korea

  • Brazil

  • Australia and New Zealand

  • South Africa

Quectel EC25

LTE Transmit Specifications

Test condition

Min

Typical

Max

Units

LTE FDD

 

 

150(DL)/50(UL)

 

Mbps

LTE TDD

 

 

130(DL)/30(UL)

 

Mbps

DC-HSDPA

 

 

42(DL)

 

Mbps

HSUPA

 

 

5.76(UL)

 

Mbps

WCDMA

 

 

384(DL)/384(UL)

 

Kbps

GSM EDGE

 

 

296(DL)/236.8(UL)

 

Kbps

GSM GPRS

 

 

107(DL)/85.6(UL)

 

Kbps

 

Please Note

DL = Download UL = Upload

Cellular bands (CAT 4)

EU Bands

LTE FDD

 

B1/ B3/ B5/ B7/ B8/ B20

LTE TDD

 

B38/ B40 /B41

3G

 

B1/ B5/ B8

US bands

LTE FDD

 

B2/ B4/ B12

3G

 

B2/ B4/ B5

AU/LAT bands

LTE FDD

 

B1/B2/B3/B4/B5/B7/B8/B28

LTE TDD

 

B40

3G

 

B1/B2/B5/B8

Electrical Specifications

Electrical Characteristics

Output Power

Sensitivity

Consumption

Class 4 (33dBm±2dB) for GSM850

LTE B1: -101.5dBm (10M)

3.6mA @Sleep, Typ.

Class 4 (33dBm±2dB) for EGSM900

LTE B2: -101dBm (10M)

35mA @Idle

Class 1 (30dBm±2dB) for DCS1800

LTE B3: -101.5dBm (10M)

 

Class 1 (30dBm±2dB) for PCS1900

LTE B4: -101dBm (10M)

 

Class E2 (27dBm±3dB) for GSM850 8-PSK

LTE B5: -101dBm (10M)

 

Class E2 (27dBm±3dB) for EGSM900 8-PSK

LTE B7: -99.5dBm (10M)

 

Class E2 (26dBm±3dB) for DCS1800 8-PSK

LTE B8: -101dBm (10M)

 

Class E2 (26dBm±3dB) for PCS1900 8-PSK

LTE B12: -101dBm (10M)

 

Class 3 (24dBm+1/-3dB) for WCDMA bands

LTE B13: -100dBm (10M)

 

Class 3 (23dBm±2dB) for LTE-FDD bands

LTE B14: -99dBm (10M)

 

Class 3 (23dBm±2dB) for LTE-TDD bands

LTE B18: -101.7dBm (10M)

 

 

LTE B19: -101.4dBm (10M)

 

 

LTE B20: -102.5dB (10M)

 

 

LTE B26: -101.5dBm (10M)

 

 

LTE B28: -102dBm (10M)

 

 

LTE B38: -100dBm (10M)

 

 

LTE B40: -100dBm (10M)

 

 

LTE B41: -99dBm (10M)

 

 

LTE B66: -99dBm (10M)

 

 

LTE B71: -100dBm (10M)

 

 

WCDMA B1: -110dBm

 

 

WCDMA B2: -110dBm

 

 

WCDMA B4: -110dBm

 

 

WCDMA B5: -110.5dBm

 

 

WCDMA B6: -110.5dBm

 

 

WCDMA B8: -110.5dBm

 

 

WCDMA B19: -110.5dBm

 

 

GSM850: -109dBm

 

 

EGSM900: -109dBm

 

 

DCS1800: -109dBm

 

 

PCS1900: -109dBm

 

 

Approvals

  • RoHS Compliant

  • CE/GCF/Vodafone (Europe)

  • FCC/PTCRB/AT&T/Verizon* (North America)

  • RCM/Telstra (Australia)

  • JATE/TELEC/DOCOMO*/Softbank* (Japan)

  • NCC (Taiwan)

  • KC/SKT/KT*/LGU+* (Korea)

  • IC/Rogers (Canada)

  • NBTC (Thailand)

  • Anatel (Brazil)

Please note

(*) Under development

Labels

Product Label

Each SolidSense unit has a unique MAC address and Serial Number as detailed below;

  • (1P) – Product SKU

  • (S) – Serial Number

  • (23S) – MAC Address

The 2D barcode matrix contains this information as well as country of origin.

 

Package Label

Each SolidSense unit has the below label on the product package; the 2D barcode matrix has this information encoded.

  • (1P) – Product SKU

  • (S) – Serial Number

  • (Q) – Quantity

 

Package Description

Length : 172mm | Width : 150mm | Height : 55mm | Weight : 415gr (Inc. packaging box)

Each product is packed into a single package with anti-static foam as shown in the picture below.

 

 

 

Bluetooth

  1. For showing all Bluetooth devices, run the following:

1 hciconfig -a
  1. Choose a device, and turn it on:

1 hciconfig hci0 up
  1. Set up the Bluetooth name:

1 hciconfig hci0 name 'SolidRun_Ble'
  1. Make your Bluetooth detectable by other devices:

1 hciconfig hci0 piscan
  1. If you want to connect to other devices:

  • Start by scanning for other Bluetooth devices:

1 hcitool scan
  • Choose a MAC address and connect :

1 rfcomm connect 0 $MAC 10 &
  • You can check the communication between the devices by writing :

1 l2ping -c 4 $MAC

Support

Please follow our SolidSense Support Overview page.

Documentation

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