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The document provides details with regards LX2162A module rev 1.0.

Below are two pictures of the SOM; the first is the top side where most of the heat is generated; and the second is from the bottom side where it connects to a carrier board -

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Specifications

LX2082A

LX2122A

LX2162A

CPU Details

NXP Layerscape LX2082A
8 x Cortex A72

NXP Layerscape LX2122A
12 x Cortex A72

NXP Layerscape LX2162A
16 x Cortex A72

CPU Speed

2.0GHz Commercial

2.0GHz Commercial

2.0GHz Commercial

RAM

Single channel
up to 32GB DDR4

Single channel
up to 32GB DDR4

Single channel
up to 32GB DDR4

Internal Storage

8GB eMMC
64MB SPI

(other ordering options available)

8GB eMMC
64MB SPI

(other ordering options available)

8GB eMMC
64MB SPI

(other ordering options available)

External Storage Support

SD
PCIe-SSD

SD
PCIe-SSD

SD
PCIe-SSD

Ethernet

Serdes block 1 (4x25 GbE / 1x100 GbE / 4x10GbE)
Serdes block 2 (8x1GbE)(*)
Sync-E, 1588-V2

1GbE with PHY

Serdes block 1 (4x25 GbE / 1x100 GbE / 4x10GbE)
Serdes block 2 (8x1GbE)(*)
Sync-E, 1588-V2

1GbE with PHY

Serdes block 1 (4x25 GbE / 1x100 GbE / 4x10GbE)
Serdes block 2 (8x1GbE)(*)
Sync-E, 1588-V2

1GbE with PHY

USB 3.0

1

1

1

PCIe

8 (Gen 3 – 2 controllers)*

8 (Gen 3 – 2 controllers)*

8 (Gen 3 – 2 controllers)*

I2C

4

4

4

UART

2

2

2

GPIO

SATA

4xGen 3(*)

4xGen 3(*)

4xGen 3(*)

Security

NXP Layerscape Secure Boot

NXP Layerscape Secure Boot

NXP Layerscape Secure Boot

SD

1

1

1

JTAG

OS Support

Linux
DPDK
UEFI

Linux
DPDK
UEFI

Linux
DPDK
UEFI

Size

55 x 48 mm

55 x 48 mm

55 x 48 mm

Interface

3 x Hirose DF40 connectors

3 x Hirose DF40 connectors

3 x Hirose DF40 connectors

Main Voltage

12V

12V

12V

I/O Voltage

3.3V/1.8V

3.3V/1.8V

3.3V/1.8V

Temperature

Commercial: 0°C to 70°C

Commercial: 0°C to 70°C

Commercial: 0°C to 70°C

Humidity

Humidity (non-condensing): 10% – 90%

Humidity (non-condensing): 10% – 90%

Humidity (non-condensing): 10% – 90%

Contact Us

Contact Us

Contact Us

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